发明名称 |
Method for micro-roughening treatment of copper and mixed-metal circuitry |
摘要 |
Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
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申请公布号 |
US2005067378(A1) |
申请公布日期 |
2005.03.31 |
申请号 |
US20030675019 |
申请日期 |
2003.09.30 |
申请人 |
FUERHAUPTER HARRY;BARON DAVID THOMAS;JOHAL KULDIP SINGH;BROOKS PATRICK PAUL |
发明人 |
FUERHAUPTER HARRY;BARON DAVID THOMAS;JOHAL KULDIP SINGH;BROOKS PATRICK PAUL |
分类号 |
C23F1/18;H05K3/02;H05K3/06;H05K3/38;H05K3/46;(IPC1-7):B44C1/22 |
主分类号 |
C23F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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