发明名称 A POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING
摘要 <p>The present invention provides in one embodiment, a polishing pad (100) for chemical mechanical polishing. The polishing pad comprises a polishing body (110). The polishing body comprises a thermoplastic foam substrate (115) having a surface (120) comprising concave cells (125). A polishing agent (130) coats an interior surface (135) of the concave cells. The polishing agent comprises an inorganic metal oxide that includes carbides or nitrides. Yet another embodiment of the present invention is a method for preparing a polishing pad (200).</p>
申请公布号 WO2005028157(A1) 申请公布日期 2005.03.31
申请号 WO2004US30013 申请日期 2004.09.14
申请人 PSILOQUEST;OBENG, YAW, S. 发明人 OBENG, YAW, S.
分类号 B24B37/04;B24D3/26;B24D3/34;B24D13/14;(IPC1-7):B24D3/26 主分类号 B24B37/04
代理机构 代理人
主权项
地址