发明名称 Ferroelectric polymer memory with a thick interface layer
摘要 According to one aspect of the invention, a memory array and a method of constructing a memory array are provided. An insulating layer is formed on a semiconductor substrate. A first metal stack is then formed on the insulating layer. The first metal stack is etched to form first metal lines. A polymeric layer is formed over the first metal lines and the insulating layer. The polymeric layer has a surface with a plurality of roughness formations. A second metal stack is formed on the polymeric layer with an interface layer, which is thicker than the heights of the roughness formations. Then the second metal stack is etched to form second metal lines. Memory cells are formed wherever a second metal line extends over a first metal line.
申请公布号 US2005070032(A1) 申请公布日期 2005.03.31
申请号 US20030676795 申请日期 2003.09.30
申请人 RICHARDS MARK R.;DIANA DANIEL C.;WINDLASS HITESH;FORD WAYNE K.;ANDIDEH EBRAHIM 发明人 RICHARDS MARK R.;DIANA DANIEL C.;WINDLASS HITESH;FORD WAYNE K.;ANDIDEH EBRAHIM
分类号 G03C5/00;G11C13/00;H01L21/00;H01L21/336;H01L29/94;H01L31/113;(IPC1-7):H01L21/00 主分类号 G03C5/00
代理机构 代理人
主权项
地址