发明名称 INCREASING THERMAL CONDUCTIVITY OF HOST POLYMER USED WITH LASER ENGRAVING METHODS AND COMPOSITIONS
摘要 The invention provides a composition having laser engraving properties, comprising a host material and a laser enhancing additive. The host material comprises a material, such as a polymer, modified by a first process, whereby the host material as modified by the first process has increased thermal conductivity as compared to the host material before the first process. The laser enhancing additive comprises a first quantity of at least one of copper potassium iodide (CuKI3), Copper Iodide (CuI), potassium iodide (KI), sodium iodide (NaI), and aluminum iodide (AlI), and a second quantity of at least one substance selected from the group consisting of zinc sulfide (ZnS), barium sulfide (BaS), alkyl sulfonate, and thioester.
申请公布号 WO2005029654(A2) 申请公布日期 2005.03.31
申请号 WO2004US30702 申请日期 2004.09.17
申请人 DIGIMARC CORPORATION;LABREC, BRIAN;JONES, ROBERT, L. 发明人 LABREC, BRIAN;JONES, ROBERT, L.
分类号 B23K26/42;B41M5/24;C08F2/46;C08J3/28;G03C1/00;G03C1/492;G03C1/494;G03C1/76;G06K5/00;H01S 主分类号 B23K26/42
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