Mounting of a semiconductor laser device by soldering

摘要

A semiconductor laser (3) has emitters (7) that are separated by LD stripes (6). Grooves (2) are formed in a mounting substrate (1) corresponding to both ends of the semiconductor laser (3). On mounting, fillets (9) are formed in the grooves (2) by molten solder, thereby reinforcing the soldering at both ends of the semiconductor laser (3) and enabling uniform bonding strength to be achieved.