| 摘要 |
A cooling apparatus for heat exchange in semiconductor manufacturing equipment is provided to prolong the lifetime of the apparatus itself by protecting feltiers from moisture using a silicon layer and to improve fabrication efficiency by loading stably the feltiers on a PCB(Printed Circuit Board) with an opening array. A cooling apparatus includes a heat exchange plate. The heat exchange plate(200) includes a plate, a first and second heat conducting plate, a silicon layer, a first and second oxidation barrier(246,247), and a first and second heat dissipating plate(248,249). The plate(241) includes openings(241b) for loading stably feltiers(242) and a circuit line layer(241a) connected with the feltiers. The first and second heat conducting plates(244,245) are stacked on top and bottom of the plate. The silicon layer(243) is formed along the edge of each heat conducting plate to protect the feltier from the outside.
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