TEMPERATURE REGULATING APPARATUS FOR SEMI-CONDUCTOR SUBSTRATE

摘要

A temperature controlling apparatus of a semiconductor substrate is provided to prevent the warpage of the substrate and to cool swiftly the substrate by using an enhanced heat conducting plate. A temperature controlling apparatus includes a heat conducting plate(1) for heating or cooling a semiconductor substrate. The heat conducting plate includes a plurality of proximity gaps(3) and a plurality of suction holes(5) for adsorbing the substrate. The suction hole is connected with a vacuum source through a path(11).