| 摘要 |
A semiconductor device includes at least one substrate (50) including a plurality of holes (56) and an interconnecting pattern (52) provided to one surface, part of the interconnecting pattern (52) being formed over the holes (56); at least one first semiconductor chip (10) including a plurality of electrodes (12) and provided to another surface of the substrate (50), at least one second semiconductor chip (20) including a plurality of electrodes (12) and provided to the one surface of the substrate (50); and a conductive member for electrically connecting the electrodes (12) of the first semiconductor chip (10) to the interconnecting pattern (52) and being disposed in the holes. |
