Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same

摘要

Substrate 10 has bumps 28, 30, 32, 34 and a substrate 20 has openings 36, 38, 40, 42 at positions in which bumps 28, 30, 32, 34 confront respectively. The substrates 10 and 22 are put together by fusing a sealing wall 26 formed on the substrate 22, to hermetically seal an electronic device lying on the substrate 10 therein. Gas that may be generated upon fusing of the sealing wall 26 can be effectively removed through the openings 36, 38, 40, 42 in the substrate 22.