| 发明名称 |
Sn-Ag BASED LEAD-FREE SOLDER |
| 摘要 |
<p>To provide a tin-silver based lead-free solder which can improve joint strength in the initial stage, and can curtail a decrease in joint strength after heat treatment, at a joined interface with an electroless plating, zinc (Zn) is added to a solder comprising a tin-silver system containing no lead. <IMAGE></p> |
| 申请公布号 |
EP1518635(A1) |
申请公布日期 |
2005.03.30 |
| 申请号 |
EP20030738613 |
申请日期 |
2003.07.01 |
| 申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
NAKAHARA, YUNOSUKE;NINOMIYA, RYUJI |
| 分类号 |
C22C13/00;B23K1/00;B23K1/20;B23K35/26;C23C18/32;(IPC1-7):B23K35/26 |
主分类号 |
C22C13/00 |
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