发明名称 BLADE FOR WAFER TRANSFER
摘要 A wafer transferring blade is provided to reduce remarkably hand-off calibration time and to prevent the deviation of a wafer by forming roundly a first and second deviation preventing protrusion. A wafer transferring blade includes a connection part, a plurality of deviation preventing protrusions, and a plurality of pockets. The connection part(14) is connected with a robot arm. The plurality of deviation preventing protrusions(16,17) are spaced apart from each other at one side of the connection part. The pocket(15,18) is installed under each deviation preventing protrusion.
申请公布号 KR20050030375(A) 申请公布日期 2005.03.30
申请号 KR20030066692 申请日期 2003.09.25
申请人 DONGBUANAM SEMICONDUCTOR INC. 发明人 AHN, JUNG HUN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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