摘要 |
A wafer transferring blade is provided to reduce remarkably hand-off calibration time and to prevent the deviation of a wafer by forming roundly a first and second deviation preventing protrusion. A wafer transferring blade includes a connection part, a plurality of deviation preventing protrusions, and a plurality of pockets. The connection part(14) is connected with a robot arm. The plurality of deviation preventing protrusions(16,17) are spaced apart from each other at one side of the connection part. The pocket(15,18) is installed under each deviation preventing protrusion.
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