发明名称 PRINTED BOARD, MANUFACTURING METHOD THEREFOR AND STRUCTURE FOR CONNECTING CONDUCTOR ELEMENTS TO THE PRINTED BOARD
摘要 There are disclosed printed board (5) on which electronic parts are mounted, a method for manufacturing the printed board, and a structure for connecting conductor elements (8, 8') to this printed board. The printed board includes an insulating supporting substrate (50) and at least one metallic terminal (53, 54). The supporting substrate is provided with at least one opening (51, 52) through the substrate, and the metallic terminal is fixed to the supporting substrate without protruding from the supporting substrate and bridges the opening. <IMAGE>
申请公布号 EP0893945(A4) 申请公布日期 2005.03.30
申请号 EP19980900724 申请日期 1998.01.22
申请人 ROHM CO., LTD. 发明人 NAKAMURA, SATOSHI;TANAKA, MASAHARU
分类号 H05K3/34;H05K3/40 主分类号 H05K3/34
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