| 摘要 |
A conditioning apparatus for a CMP(Chemical Mechanical Polishing) apparatus is provided to prolong the lifetime of a pad and to reduce fabrication costs by using an ultrasonic generator. A conditioning apparatus includes a polishing pad(11) attached on a polishing table(10), a conditioner(13) for cleaning the polishing pad, a deionized water nozzle(15) for supplying deionized water onto the polishing table, and an ultrasonic generator(16) installed in the polishing table.
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