| 摘要 |
Provided is a slurry composition for polishing a metal wire which is improved in the selectivity of polishing velocity to an insulating layer. The slurry composition comprises 1-25 wt% of a metal oxide fine powder; 0.1-10 wt% of a peroxide; 0.001-0.05 wt% of an inorganic acid; 0.01-10 wt% of a carboxylic acid; 0.01-1.0 wt% of a metal complex; 0.001-2.0 wt% of methyltrichlorosilane and/or trichloronitromethane; and the balance of deionized water. Preferably the metal oxide fine powder is silica, alumina, ceria, titania or their mixture; the peroxide is at least one selected from the group consisting of hydrogen peroxide, benzoyl peroxide, calcium peroxide, barium peroxide and sodium peroxide; the inorganic acid is at least one selected from the group consisting of nitric acid, sulfuric acid, hydrochloric acid and phosphoric acid; the carboxylic acid is at least one selected from the group consisting of acetic acid, citric acid, glutaric acid, glycolic acid, formic acid, lactic acid, malic acid, oxalic acid, phthalic acid, succinic acid and tartaric acid; and the metal complex is PDTA-Fe, EDTA-Fe, PDTA-Fe or EDTA-Mn. |
