| 发明名称 |
HIGH PERFORMANCE RF INDUCTORS AND TRANSFOMERS USING BONDING TECHNIQUE |
| 摘要 |
<p>A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.</p> |
| 申请公布号 |
SG109447(A1) |
申请公布日期 |
2005.03.30 |
| 申请号 |
SG20010002174 |
申请日期 |
2001.04.18 |
| 申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD |
发明人 |
YEO KIAT SENG;TAN HAI PENG;MA JIANGUO;DO MANH ANH;CHEW KOK WAI, JOHNNY |
| 分类号 |
H01F17/00;H01F41/04;H01L23/522;H01L23/64;(IPC1-7):H01F41/04;H01F5/00 |
主分类号 |
H01F17/00 |
| 代理机构 |
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