| 摘要 |
A process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by melting dry solder powder previously deposited on a pocketed-PCB 20. The process and apparatus utilize as heat source an electrically heated conveyor wire mesh 76 instead of a reflow oven. This invention, unlike the prior art for producing SSD-PCB, can readily utilize dry solder powder in conjunction with flux layers 116 separately deposited on top of the conveyor wire mesh 76 thereby excluding the use of solder paste and associated paste printing equipment. Specifically the invention reduces the manufacturing cost because: shortens manufacturing time, reduces manufacturing energy consumption and requires less manufacturing equipment than prior art.
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