发明名称 Surface mountable laminated thermistor device
摘要 The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.
申请公布号 US6873244(B2) 申请公布日期 2005.03.29
申请号 US20030440916 申请日期 2003.05.19
申请人 PROTECTRONICS TECHNOLOGY CORPORATION 发明人 HUANG CHIEN-SHAN;HWANG REN-HAUR;CHANG CHIH-YI
分类号 H01C1/14;H01C7/02;(IPC1-7):H01C7/13 主分类号 H01C1/14
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