发明名称 |
Surface mountable laminated thermistor device |
摘要 |
The present invention discloses a surface mountable laminated thermistor device which utilizes current-used double sided metal foil clad substrate as a base material and a PTC conductive composite that complies with circuit connection design combinations among electrodes to obtain a surface mountable laminated thermistor device with a parallel manner, and vastly simplify the fabrication process of the surface mountable laminated thermistor device.
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申请公布号 |
US6873244(B2) |
申请公布日期 |
2005.03.29 |
申请号 |
US20030440916 |
申请日期 |
2003.05.19 |
申请人 |
PROTECTRONICS TECHNOLOGY CORPORATION |
发明人 |
HUANG CHIEN-SHAN;HWANG REN-HAUR;CHANG CHIH-YI |
分类号 |
H01C1/14;H01C7/02;(IPC1-7):H01C7/13 |
主分类号 |
H01C1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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