发明名称 |
Semiconductor circuit device adaptable to plurality of types of packages |
摘要 |
Data pad regions are arranged in four divided regions of a semiconductor memory chip of a rectangular shape, respectively, and data pads are selectively utilized in each of the four divided regions in accordance with a word structure. Thus, it is possible to implement a semiconductor memory chip capable of being assembled in both a single chip package and a multi chip package.
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申请公布号 |
US6873563(B2) |
申请公布日期 |
2005.03.29 |
申请号 |
US20030390886 |
申请日期 |
2003.03.19 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
SUWA MAKOTO;MATSUMOTO JUNKO;YAMAUCHI TADAAKI;OKAMOTO TAKEO;ICHIGUCHI TETSUICHIRO;YONETANI HIDEKI;NAGASAWA TSUTOMU;TIAN ZENGCHENG |
分类号 |
H01L27/04;G11C5/00;G11C5/02;G11C5/06;G11C8/00;G11C11/34;G11C11/401;G11C11/406;G11C11/407;G11C11/409;H01L21/822;H01L23/50;H01L27/10;H02J1/00;(IPC1-7):G11C8/00 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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