SEMICONDUCTOR INTEGRATED CIRCUIT APPARATUS AND ELECTRONIC DEVICE

摘要

A semiconductor integrated circuit apparatus is provided to reduce a phenomenon that a bump is peeled from a mounting substrate even when the mounting substrate is transformed by thermal stress by bonding a BGA(ball grid array)-type or PGA(pin grid array)-type integrated circuit to the mounting substrate while using a bump or a pin-type electrode which is uniformly disposed as the same shape. A plurality of pads having substantially the same size are disposed in a predetermined region of one surface of a grid array-type semiconductor integrated circuit apparatus. A plurality of bumps(130) of substantially the same size installed in the plurality of pads are disposed as a grid type in the semiconductor integrated circuit apparatus. The pads among the plurality of pads except the outermost pad are used as signal pads(110S) to be connected to an inner circuit. The outermost pad is used as a reinforcing pad(110F) connected to the signal pad by an interconnection. Each bump is installed in the signal pad and the reinforcing pad.