发明名称 |
Composite substrate carrier |
摘要 |
A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.
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申请公布号 |
US6871741(B2) |
申请公布日期 |
2005.03.29 |
申请号 |
US20020213282 |
申请日期 |
2002.08.05 |
申请人 |
ENTEGRIS, INC. |
发明人 |
BHATT SANJIV M.;EGGUM SHAWN D. |
分类号 |
B29C45/14;B29C45/16;B29K69/00;B29K73/00;B29K79/00;G03F7/20;H01L21/673;(IPC1-7):B65D85/48 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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