| 摘要 |
The present invention is directed to a process which comprises removing and stripping off part of the display panel in order to expose and connect the conductor lines on an electrode plate to a driver circuitry. More specifically the process involves (1) preparing a display panel having filled display cells sandwiched between a first and a second substrate layers, preferably by a roll-to-roll process; (2) removing part of a first substrate by asymmetrical cutting by, for example, a die, diamond, knife or laser cutting method to expose the layers underneath (which may include adhesive layer, primer layer, display cell layer and in the case of a display prepared by the microcup technology, the microcup layer and the sealing layer); and (3) stripping off the exposed layers by a stripping solvent or solution. After stripping, the conductor lines on the second substrate are exposed and ready for connection to the driver circuitry.
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