| 摘要 |
An apparatus and method for attaching a wafer are provided to reduce the oxidation of a wafer surface without the damage of surface charge by purging plasma using a gas purging part in desired conditions. An apparatus includes a gas purging part(15) connected with a chamber(10), a first part(20) for holding and aligning a first wafer(22), a second part(24) for holding and aligning a second wafer(26) on the first wafer, a plasma burner(33) for forming plasma in the chamber, a vacuum pump(17) for forming vacuum in the chamber, and a control part(40).
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