| 摘要 |
<p>A method and apparatus are provided to improve productivity by detecting the failure of bumps while bonding a wire to a first and second conductor using an enhanced computer. A wire bonding apparatus includes a bonding arm, a linear motor, a position sensor, and a computer. The bonding arm(20) includes a capillary(5). The bonding arm is supported by a support frame(21). The linear motor(25) drives the bonding arm. The position sensor(29) detects the position of the bonding arm. The computer(41) includes a height counter(44) for generating a height signal of the capillary, a memory(60) for storing capillary position in second bonding, and a comparator(61) for generating a failure signal in case of an unallowable error range between an output of the height counter and the capillary position stored in the memory.</p> |
