发明名称 |
СПОСОБ ИЗГОТОВЛЕНИЯ МОДУЛЯ |
摘要 |
A method is described for producing a module to be incorporated in a card body wherein a module carrier is provided with a conductive structure on one side. During production of the module carrier, a material whose properties essential for a certain manner of connection with a layer of material of the card body upon incorporation of the module in the card body are adjusted to said layer of material is used at least for a first layer of the module carrier located on the side opposite the conductive structure. |
申请公布号 |
RU2003128886(A) |
申请公布日期 |
2005.03.27 |
申请号 |
RU20030128886 |
申请日期 |
2002.02.28 |
申请人 |
ГИЗЕКЕ УНД ДЕВРИЕНТ ГМБХ (DE) |
发明人 |
Ях ХАГХИРИ (DE);Рене-Люси БАРАК (DE);Йозеф РИДЛЬ (DE) |
分类号 |
B42D15/10;G06F17/00;G06K19/077;H05K5/00 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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