| 摘要 |
PROBLEM TO BE SOLVED: To provide flattening finish etching liquids and an etching treatment method therefor which meet the need of the line-thinning, thinning and high functionalization of a printed circuit board by copper, a copper alloy or the like, . SOLUTION: The etching liquids is used for flattening finish for copper and a copper alloy by first and second etching stages. A first etching liquid used in the first etching stage and a second etching liquid used in the second etching stage are aqueous solutions both consisting of hydrogen peroxide and sulfuric acid as the main agents dissolving the copper and copper alloy. The etching liquids is prepared in such a manner that the first etching liquid contains aliphatic amines as an additive to the main agent, and the second etching liquid contains azoles as an additive to the main agent. COPYRIGHT: (C)2005,JPO&NCIPI
|
