| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently carry out a cutting process for cutting, in a high quality, a rolled sheet encapsulating the IC inlets of a plurality of IC cards into a laminate sheet having a predetermined dimension. <P>SOLUTION: The laminate sheet as the IC card intermediate is produced by applying an adhesive on a first substrate sheet, placing the inlets of a plurality of IC modules on the predetermined positions, laminating a second long substrate sheet on the first substrate sheet via the adhesive to form the rolled sheet, and cutting the rolled sheet again in the predetermined dimension every first substrate sheet to produce a laminate sheet as a sheet-fed IC card intermediate. In this case, a conveying means B for the rolled sheet in an upstream side adjacent to a cutting means and a conveying means C for the rolled sheet in the downstream side are synchronized with each other in conveyance speed with respect to a conveying means A in the upstream side of the means B and with respect to the means B, respectively, by a minute speed increase torque control, and are driven so that the cut laminate sheet is minutely increased in speed immediately after cutting. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
