发明名称 COPPER CLAD LAMINATEED SHEET AND MULTILAYERED BOARD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a copper clad laminated sheet excellent in the irregularity resistance of molding thickness at the time of lamination, thermal and mechanical impact resistance and migration resistance in a Z-direction as compared with a copper clad laminated sheet of a fiber cloth base material and enhanced in mechanical strength such as elastic modulus or the like as compared with a flexible copper clad laminated sheet, and a multilayered board using it. SOLUTION: This copper clad laminated sheet is constituted by providing a copper layer at least on one side of a composite base material laminated sheet wherein a heat-resistant film base material B-stage resin composition sheet is used at least in the outermost layer and at least one inorganic and/or organic fiber base material prepreg is used in an intermediate layer. The multilayered sheet is constituted using this copper clad laminated sheet and the heat-resistant film base material B-stage resin composition sheet is used in a build-up layer and/or a bonding layer. By this constitution, both of the copper clad laminated sheet and the multilayered board are excellent in the irregularity resistance of molding thickness at the time of lamination, thermal and mechanical impact resistance and migration resistance in a Z-direction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005074819(A) 申请公布日期 2005.03.24
申请号 JP20030308256 申请日期 2003.09.01
申请人 MITSUBISHI GAS CHEM CO INC 发明人 TAKE MORIO;IKEGUCHI NOBUYUKI;OMORI TAKAFUMI
分类号 B32B15/08;B32B15/088;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):B32B15/08 主分类号 B32B15/08
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