| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form a via hole in a shorter time compared to the case of using plating as a means of interlayer connection and to improve the electric reliability of an interlayer connection part compared to the case of using a conductive composition. SOLUTION: For a multilayer wiring board (1), on a base material (2) for the multilayer wiring board for which an insulating base material (10) having a conductive layer (13) forming a wiring pattern is clamped by two insulating base materials (20) having a conductive layer (23) on one surface and laminated, a through-hole (3) passing through the respective conductive layers (13 and 23) is formed. Then, plating (4) is executed as a preprocessing on the side face of the through-hole (3), and a metal sphere (5) is arranged at either front or back opening of the through-hole (3), melted by heating, filled inside the through-hole (3) and turned to a filled metal (6). COPYRIGHT: (C)2005,JPO&NCIPI |
