发明名称 METHOD FOR APPLYING PRESSURE-SENSITIVE ADHESIVE TO THIN-WALLED COMPONENT AND TOOL USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a method for uniformly and efficiently applying a pressure-sensitive adhesive to a thin-walled component in a proper thickness, and a tool suitably used therein. SOLUTION: This application method of the pressure-sensitive adhesive to the thin-walled part includes a process for bonding a mounting film 4 to the surface on the side of the pressure-sensitive adhesive layer 3 of a sheet wherein the pressure-sensitive adhesive layer 3 is formed to one side of mold release paper, a process for punching the mold release paper and the pressure-sensitive adhesive layer 3 into the shape of the desired component, a process for removing the mold release paper and the pressure-sensitivie adhesive layer other than the component part, a process for removing the mold release paper of the component part and a process for covering the pressure-sensitive adhesive layer 3, which is bonded to the surface of the cardboard film 4 obtained in the respective processes in the shape of the component, with a press plate 12 having a through-hole 12a formed thereto in the shape of the component so as to overlap the pressure-sensitive adhesive layer 3 with the through-hole 12a and subsequently fitting the thin-walled component 2 in the through-hole 12a to press the same to the pressure-sensitive adhesive layer 3. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005074752(A) 申请公布日期 2005.03.24
申请号 JP20030306533 申请日期 2003.08.29
申请人 NISHIURA TOSHIAKI 发明人 NISHIURA TOSHIAKI
分类号 B29C65/78;B29C65/48;B29L9/00;(IPC1-7):B29C65/78 主分类号 B29C65/78
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