TERMINAL ELECTRODE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC EQUIPMENT, METHOD OF MANUFACTURING TERMINAL ELECTRODE, AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To increase the joint area of a projecting electrode without increasing the number of steps. SOLUTION: A protective film 4 is provided on an electrode pad 2 across the pad 2, and the recessed section 7 corresponding to the shape of the protective film 4 is formed on the surface of the projecting electrode 6 by electroless plating. Then the projecting electrode 6 is joined to a terminal electrode in a state where the terminal electrode is fitted in the recessed section 7 of the projecting electrode 6. COPYRIGHT: (C)2005,JPO&NCIPI