| 摘要 |
PROBLEM TO BE SOLVED: To provide a combined structure body of a chassis and a printed board provided with a signal transmission line of high frequency signals capable of being prepared without depending on the thickness of the printed board, for which an area to form a conductive pattern is not reduced, the need of the process of soldering or the like is eliminated and its attaching process is not complicated. SOLUTION: The combined structure body composed of the chassis 10 provided with an insulator part whose surface is coated with a conductive film and the printed board 20 where a plurality of circuits are loaded is structured such that the conductive film on the surface of the chassis is divided into two parts, a first part is an electrode film 13 for signal transmission, a second part is electrically separated from the first part, the printed board is provided with two terminal 22a and 22b on the main surface, and in the state of combining the printed board and the chassis, the terminals are brought into contact with the electrode film for the signal transmission and two circuits on the board are connected by the electrode film for the signal transmission. COPYRIGHT: (C)2005,JPO&NCIPI
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