| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic part by which delamination and a crack occurrence rate after calcination can be drastically reduced. SOLUTION: A dielectric paste is applied on a flexible supporting body 19 to form a ceramic dielectric layer, resulting in an electrode 61 thereon. Then a green sheet that is obtained by peeling off the ceramic dielectric layer is laminated and press-fitted, and it is divided to produce lamination green chips. A binder removing step is conducted to remove a binder from the lamination chip, and it is calcinated. In this case, assuming that a changing rate T between the lamination thickness T0 of the lamination chip before the binder removing step and that T1 thereof after the binder removing step is ((T1-T0)/T0)×100 (%) and the peeling force of a lamination boundary surface is F (gf/mm<SP>2</SP>), the relationship therebetween satisfies F>26T+102.8. COPYRIGHT: (C)2005,JPO&NCIPI
|
