| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device that has an interlayer insulating film of a low dielectric constant and containing an organic thin film having a relative dielectric constant of 2.0-2.4. SOLUTION: In this method, the adhesive property between an inorganic film and the organic thin film is improved by keeping the surface of a base film in a hydrophobic surface having a contact angle of≥50°with water, after a base film forming process performed before the organic thin film is formed by the chemical vapor growth method or before an organic thin film forming process. When the adhesive property is improved, the occurrence of defects, such as the peeling of films, cracks, etc., can be prevented in a multilayered wiring forming process and the electronic device, such as the semiconductor device provided with an organic thin film having a low dielectric constant can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
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