发明名称 Apparatus and method for metal plasma immersion ion implantation and metal plasma immersion ion deposition
摘要 This invention is a method for metal plasma ion implantation and metal plasma ion deposition, comprising: providing a vacuum chamber with at least one workpiece having a surface positioned on a worktable within the vacuum chamber; reducing the pressure in the vacuum chamber; generating a plasma of metal ions within the vacuum chamber, applying a negative bias to the worktable to thereby accelerate metal ions from the plasma toward at least one workpiece to thereby either implant metal ions into or deposit metal ions onto the workpiece or both. This invention includes an apparatus for metal ion implantation and metal ion plasma deposition, comprising: a vacuum chamber, a metal plasma generator within the vacuum chamber, and at least one worktable within the vacuum chamber.
申请公布号 US2005061251(A1) 申请公布日期 2005.03.24
申请号 US20040932925 申请日期 2004.09.02
申请人 WEI RONGHUA;BOOKER THOMAS;RINCON CHRISTOPHER;ARPS JAMES 发明人 WEI RONGHUA;BOOKER THOMAS;RINCON CHRISTOPHER;ARPS JAMES
分类号 C23C14/00;C23C14/26;C23C14/30;C23C14/32;C23C14/48;C23C16/00;H01J37/32;(IPC1-7):C23C16/00 主分类号 C23C14/00
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