| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is high in reliability, a method for manufacturing the semiconductor device, a circuit board and electronic apparatus. <P>SOLUTION: A semiconductor chip 30 having a plurality of bumps 40 arranged in a row at intervals is mounted on a wiring board having a wiring pattern including a plurality of electric connecting parts 22 arranged in a row at intervals, and the electric connecting parts 22 and the bumps 40 are faced to each other, and electrically connected. The bumps 40 contain reference bumps 42. The width of each of the bumps 40 is made wider according as the bumps 40 are arranged farther from the reference bumps 42. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
