PROCESSING METHOD OF SINGLE CRYSTAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a processing method of a single crystal substrate for forming a fine through-hole or non-through-hole having a high aspect ratio to a substrate constituted of a material comprising a single crystal.

SOLUTION: This processing method is constituted so as to form the through-hole 2 to the substrate 1 constituted of the material comprising the single crystal along a predetermined route 8 and has laser irradiation process [Figs. (b)-(d)] for irradiating the substrate 1 with a laser beam to modify the material of the substrate 1 along the predetermined route 8 to form a material modified part 7 and an anisotropic etching process [Fig. (e)] for etching the material modified part 7 to form the through-hole 2 along the predetermined route 8.

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