| 摘要 |
A method of manufacturing a substrate including an electronic component, the method includes the steps of: preparing an electronic component having a terminal portion; preparing a first insulative sheet; mounting the electronic component to a surface of the first insulative sheet so that the terminal portion is opposed to the first insulative sheet; forming an opening portion in the first insulative sheet so that a surface of the terminal portion is exposed; and forming a conductive material that is extended from the terminal portion to an upper portion of the first insulative sheet.
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