| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method which is capable of forming a protective film that is more uniform in thickness through all the surface of a substrate without being affected by a difference in the shape or heat capacity of a wiring pattern at several points on the substrate. SOLUTION: A buried wiring is formed on the surface of the substrate. When the protective film is selectively formed on the exposed surface of the buried wiring, the wiring and the protective film are formed while restraining their wiring pattern-dependent properties caused by the supply rate control of reactive seeds. COPYRIGHT: (C)2005,JPO&NCIPI |
