| 摘要 |
PROBLEM TO BE SOLVED: To provide an evaluation method and an apparatus, capable of accurately measuring the solderability of various lead-free solder paste used for electronic and electrical products. SOLUTION: By forming an environment for easy wetting of the various lead-free solder paste 2, as much as possible, for evaluating the wettability of the various lead-free solder paste 2 is created for carrying out evaluation. As its means, the various lead-free solder paste 2 is printed onto a test jig plate 1 made of copper, and a test plate 3 made of copper is immersed in it. A copper plate is placed erect and perpendicular to the test jig plate 1. When the test jig plate is placed on a hot plate and heated, various lead-free solder paste 2 is wetted and travels along a seam constituted between the test jig plate 1 and the test plate 3. By measuring the wetting and traveling speeds and distances at this time, wettabilities of the various lead-free solder pastes 2 are evaluated. COPYRIGHT: (C)2005,JPO&NCIPI
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