发明名称 |
Integrated circuit package design |
摘要 |
A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.
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申请公布号 |
US2005062143(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040979491 |
申请日期 |
2004.11.02 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
JOSHI MUKUL A.;NAGAR MOHAN R.;RAJAGOPALAN SARATHY |
分类号 |
H01L23/36;H01L23/42;H01L23/433;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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