发明名称 |
Method for mounting a semiconductor package onto PCB |
摘要 |
A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals is connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the corresponding exposed centers of the contact pad to prevent the fine pitch contact pads from bridging.
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申请公布号 |
US2005061854(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040942789 |
申请日期 |
2004.09.17 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIU PAI-CHOU;CHUANG HSIN-FU |
分类号 |
B23K31/02;H01L23/48;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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