发明名称 Infrared sensor device and manufacturing method thereof
摘要 A supporting beam line for supporting, afloat in a cavity on a semiconductor substrate, an infrared detection pixel comprising an infrared absorption portion for absorbing an incident infrared ray and converting it into heat and a thermoelectric conversion portion for converting a temperature change caused by the heat generated in the infrared absorption portion into an electric signal is formed by a damascene metal on the same layer as the gate of a damascene metal gate MOS transistor to be used in a peripheral circuit. The supporting beam line comprises a conductor line with U-shaped cross section inside which a metal is filled.
申请公布号 US2005061980(A1) 申请公布日期 2005.03.24
申请号 US20040960988 申请日期 2004.10.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IIDA YOSHINORI;SHIGENAKA KEITARO;MASHIO NAOYA
分类号 G01J1/02;G01J5/20;G01J5/24;H01L21/28;H01L27/14;H01L27/146;H01L27/16;H01L29/423;H01L29/43;H01L29/49;H01L29/786;H01L31/09;H01L37/02;(IPC1-7):G01J5/20 主分类号 G01J1/02
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