PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF

摘要

[PROBLEMS] A photosensitive insulating resin composition is disclosed which can be cured at low temperature without interfering with functions of an organic semiconductor device or the like. The photosensitive insulating resin composition enables to obtain a cured product which is excellent in various characteristics such as resolving power, electrical insulation, thermal shock resistance and chemical resistance, and is preferably used for surface protecting films and interlayer insulating films of semiconductor devices. [MEANS FOR SOLVING PROBLEMS] The photosensitive insulating resin composition is characterized by containing a copolymer (A) which is obtained by copolymerizing monomeric units including a vinyl monomer having an epoxy group and another vinyl monomer having an oxetanyl group, and a photo acid-generating agent (B). The copolymer (A) is preferably obtained by copolymerizing monomeric units including a vinyl monomer having an epoxy group, another vinyl monomer having an oxetanyl group, and still another vinyl monomer.