发明名称 |
Thermosetting resin composition of low thermal expansibility and resin film |
摘要 |
The invention relates to a thermosetting resin composition comprising: a binder containing a thermosetting resin having a storage elastic modulus of 1,000 MPa or less at 20° C. and an elongation of 10% or more at 20° C.; and an inorganic filler in an amount of 100 to 2,000 parts by weight with respect to 100 parts by weight of the binder. According to the invention, it provides a thermosetting resin composition and resin film which have a low thermal expansion coefficient and able to possess a low elastic modulus, a high extensibility, and a low thermal expansion coefficient. |
申请公布号 |
US2005065275(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040490646 |
申请日期 |
2004.11.08 |
申请人 |
HITACHI CHEMICAL CO., LTD |
发明人 |
TAKAHASHI ATSUSHI;BABA HIDEO;MADARAME KEN;NAKAKO HIDEO;TAKANO NOZOMU |
分类号 |
C08J5/18;C08K3/00;(IPC1-7):C08L83/04 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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