| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of cleaning high in cleaning efficiency and especially capable of efficiently cleaning even when cleaning a lot of works at the time of cleaning the works in which minute spaces between flat plates and flat plates such as IC packages installing flop chips. SOLUTION: When such works W that minute spaces are formed between substrates Wa and chips Wb are cleaned, space parts x, y at both the sides of the minute spaces by pinching works W by pairs of pinching members 2a, 2b, and any other places are closely sealed, and the works W are cleaned by effectively circulating a cleaning liquid into the minute spaces owing to supplying the cleaning liquid to one-side spaces x and simultaneously making the other-spaces y vacuum. Preferably, a lot of works are held in a stacking state of a lot of pinching members 2c and the works are preferably cleaned with an ultrasonic wave when the cleaning liquid is circulated. COPYRIGHT: (C)2005,JPO&NCIPI
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