| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part packaging apparatus and a method for packaging an electronic part which can package an electronic part with the constantly stable, highly reliable bonging strength of the part and without depending on packaging conditions, packaging parts, and so on, and an electronic circuit board and an electric circuit apparatus which can be expected to have a constantly stable, highly reliable circuit operation. SOLUTION: An electronic part 20 is packaged on a circuit board 10 by performing ultrasonic vibrations of horns 53, 54 in at least two directions relative to the bonding surface 20a of the electronic part 20 packaged on the surface 10a to be bonded of the circuit board 10 to bond the bonding surface 20a of the electronic part 20 to the surface 10a to be bonded of the circuit card 10. COPYRIGHT: (C)2005,JPO&NCIPI
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