发明名称 |
Semiconductor device having heat dissipation layer |
摘要 |
A semiconductor device includes a semiconductor constructing body which has a semiconductor substrate, a plurality of external connection electrodes formed on the semiconductor substrate, and heat dissipation columnar electrodes. Upper interconnections are mounted on one side of the semiconductor constructing body and connected to the external connection electrodes of the semiconductor constructing body. A heat dissipation layer is mounted on one side of the semiconductor constructing body and made of the same material as that of the upper interconnections.
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申请公布号 |
US2005062147(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040940232 |
申请日期 |
2004.09.13 |
申请人 |
CASIO COMPUTER CO., LTD. |
发明人 |
WAKISAKA SHINJI;JOBETTO HIROYASU |
分类号 |
H01L23/52;H01L21/3205;H01L21/768;H01L23/12;H01L23/31;H01L23/34;H01L23/367;H01L23/498;H05K1/00;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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