| 摘要 |
A composition for removing copper from a surface comprises a polyphosphonic acid, a primary amine, and water. Optionally, the composition may also comprise a dialkanolamine and/or a trialkanolamine, a degreaser, and/or a surfactant. The pH of the composition is between 9.0 and 12.5. The method of removing copper from a surface, which may be a gun bore, involves contacting the surface with the composition. |
