| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state imaging apparatus whereby inexpensive packages can be fabricated by avoiding deformation on the packages, the deformation being caused by a difference in thermal expansion between a wiring board and a resin rib when collectively fabricating the packages for constituting two or more solid-state imaging apparatuses. <P>SOLUTION: A rib forming member 10, in which two or more pairs of frame-like ribs for constituting two or more solid-state imaging apparatuses are collectively disposed, is formed of resin in gridlike fashion. Areas corresponding to two or more wiring boards are provided, an aggregate wiring board 11 is prepared on which two or more wiring members 12 are disposed on the areas, imaging devices 14 are fixed to the areas of the aggregate wiring board, and the electrodes of the imaging device and the wiring members are connected via metal thin lines 15. The rib forming member is caused to face a surface of the wiring board and is joined thereto with an adhesive 16a such that the imaging device is disposed in each grid of the rib forming member. A transparent plate 17 is joined to the upper end face of the rib forming member, cutting is performed for each package perpendicularly to the board and in a direction that divides the width of each rib forming member into two, and the solid-state imaging apparatus are separated from one another. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
