发明名称 |
Surface emitting laser package having integrated optical element and alignment post |
摘要 |
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
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申请公布号 |
US2005062055(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20030665662 |
申请日期 |
2003.09.19 |
申请人 |
GALLUP KENDRA;BAUGH BRENTON A.;WILSON ROBERT E.;MATTHEWS JAMES A.;WILLIAMS JAMES H.;WANG TAK KUI |
发明人 |
GALLUP KENDRA;BAUGH BRENTON A.;WILSON ROBERT E.;MATTHEWS JAMES A.;WILLIAMS JAMES H.;WANG TAK KUI |
分类号 |
H01S5/022;G02B6/42;G02B7/00;H01L29/22;H01L29/24;H01L31/0232;H01L31/16;H01S5/00;H01S5/02;H01S5/026;H01S5/183;H01S5/42;(IPC1-7):H01L29/22 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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